Existing Mold Solutions
Confirm current tooling, drawing, finish and production conditions for the selected reference.
Glass Packaging
Advanced Glass & Electronic Materials
Materials and components for electronic packaging, optical communication, substrates, sealing and other demanding applications, supported by technical coordination and current source documentation.
Selection Criteria
Review the complete package and process.
Materials and components for electronic packaging, optical communication, substrates, sealing and other demanding applications, supported by technical coordination and current source documentation.
- Bottle or jar finish
- Contents and filling conditions
- Sealing and tamper-evidence requirement
- Liner, material and decoration
- Filling-line compatibility and testing
Development Route
Existing options or custom development.
Custom Development
Review geometry, capacity, finish, closure, tooling, samples and acceptance criteria.
HTK
Send your product and process requirements.
Final suitability, MOQ and production conditions are confirmed by the current drawing and quotation.