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Ceramic Electronic Materials

LTCC & HTCC Green Tapes: Full Grade Comparison

Compare the LTCC and HTCC grades listed in the supplied product workbooks. Values are representative preliminary-selection data and should be confirmed for the selected grade, thickness, firing condition and test method.

Technical verification path

Prepare the evidence needed after the first sales contact.

02

LTCC selection guide

Compare electrical, dimensional, thermal and process requirements.

Open guide
03

Replacement evaluation

A controlled path for screening an existing commercial LTCC process.

Open evaluation
04

Electronic materials FAQ

Direct answers on data status, samples, TDS and qualification.

FAQ

LTCC / HTCC

LTCC and HTCC material scope

LTCC uses ceramic and glass powders in a green-tape system that can be co-fired with conductors at a lower temperature than conventional alumina ceramics. HTCC is based mainly on alumina or aluminium nitride with organic binders and is co-fired at high temperature with refractory-metal conductors such as tungsten or molybdenum.

  • LTCC shrinkage-control capability below ±0.3% for applicable systems
  • Printing adaptability down to L/S 50 µm / 50 µm for applicable systems
  • Custom size, thickness, shrinkage, color and physical properties
  • Sheet or roll supply, prototype lots from 100 sheets, and matching printing or via pastes

LTCC

HTK-series LTCC catalog (11 grades)

Common catalog format: LTCC up to □500 mm and 55–200 µm; HTCC up to □420 mm and 55–250 µm. Availability depends on grade and project review.

Swipe horizontally to view all specifications.

Grade Feature XY shrinkage (%) XY accuracy Z shrinkage (%) Density (g/cm³) Flexural strength (MPa) Dielectric constant (1 MHz) tanδ (1 MHz) Dielectric constant (10 GHz) tanδ (10 GHz) CTE (ppm/K) Thermal conductivity (W/m·K) Elastic modulus (GPa)
HTK-071 Standard dielectric 13.3 ±0.3% 28 2.85±0.05 220 7.1±0.2 <0.003 6.8 0.006 5.7 2.8 112
HTK-072 Improved strength 15.3 ±0.3% 26–30 2.92±0.05 ≥250 7.3±0.2 <0.003 6.8 5.9 2.5
HTK-025 High dielectric 12.8 ±0.3% 22–26 3.6±0.03 ≥190 26±1 <0.003 27 10.7 1.7 104
HTK-040 High dielectric 15.3 ±0.3% 24–30 5.70±0.05 ≥170 40±2 42
HTK-4D Low dielectric constant 19.5 ±0.5% 16.5 2.16 120 4.4±0.2 <0.001 4.2 0.0025 4.3 1.8
HTK-4Y Low dielectric family 13.7 ±0.5% 32 2.56 130 4.0±0.2 <0.003 4 0.0025 2.9
HTK-6D Low loss 15.3 ±0.3% 23 2.75 165 6.2 <0.001 6 0.0004 6.7 100
HTK-7KD High frequency 21 ±0.5% 35 3.3 290 7.2 <0.001 7.4 0.002 9.5 2.3
HTK-012 High CTE 15.2 ±0.3% 35 2.85 220 6.3 <0.005 6.6 0.004 12.6
HTK-014 High CTE family 15.4 ±0.3% 26 2.65 140 5.9 <0.003 6.6 0.005 11.2
HTK-78S High strength 13.8 ±0.3% 29 2.98 390 7.8 <0.003 7.9 0.0052 6.2 4.6 150

The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.

HTCC

HTCC alumina green-tape catalog (3 grades)

Common catalog format: LTCC up to □500 mm and 55–200 µm; HTCC up to □420 mm and 55–250 µm. Availability depends on grade and project review.

Swipe horizontally to view all specifications.

Grade Feature Alumina purity XY shrinkage (%) XY accuracy Z shrinkage (%) Density (g/cm³) Flexural strength (MPa) Dielectric constant (1 MHz) tanδ (1 MHz) Dielectric constant (10 GHz) tanδ (10 GHz) CTE (ppm/K) Thermal conductivity (W/m·K) Elastic modulus (GPa)
HTKAHP100 Standard alumina content ≥97.5% 13.6 ±0.3% 20–23 3.85±0.05 320 9.5±0.2 <0.45 0.006 6.4 ≥28
HTKAHP100S High alumina content ≥99.6% 15.1 ±0.3% 23 3.87±0.05 400 9.5±1 0.025 ≥0.025 6.5–7.5 ≥28
HTKAHP200 Ultra-high alumina content ≥99.9% 16 ±0.3% 20 3.9±0.05 400 9.5±1 0.025 ≥0.025 6.5–7.5 ≥28

The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.

Custom Support

Material and process support

Custom sheet size, thickness, shrinkage control, color, physical properties and sheet or roll supply can be reviewed. Small prototype lots and matching printing or via-paste requirements can also be discussed.

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