Sealing & Solder Glass
Low-temperature sealing, glass-to-metal and glass-to-ceramic material systems.
Electronic Materials / Functional Glass
Functional Glass Materials Matched to the Application
HTK supplies glass powder and paste families for sealing, bonding, coating, sintering and electronic applications. Material selection is based on substrate, temperature profile, thermal expansion, electrical performance and process method.
Supplied Product Images
Glass powders, sealing materials and application forms.
Glass Powder Models
Model-by-model glass transition, softening point and CTE data.
Detailed composition, particle-size distribution, atmosphere limits and compatibility data are available upon request.
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| Model | Glass chemistry | Tg | Softening point | CTE ×10⁻⁷/°C | Selection cue |
|---|---|---|---|---|---|
| BS66 | Bi₂O₃–B₂O₃–ZnO–SiO₂ | 380°C | 445°C | 98 | Low-temperature / high CTE |
| LY23 | Bi₂O₃–B₂O₃–ZnO–SiO₂ | 435°C | 495°C | 88 | General sintering aid |
| BN40 | Bi₂O₃–B₂O₃–ZnO–SiO₂ | 455°C | 530°C | 78 | General sintering aid |
| LN79 | PbO–B₂O₃ | 235°C | 300°C | 145 | Lowest softening / contains Pb |
| CN55 | SiO₂–B₂O₃–R₂O | 465°C | 590°C | 77 | Lower CTE |
| CN50 | SiO₂–B₂O₃–R₂O | 495°C | 595°C | 73 | Lower CTE |
| BS3 | SiO₂–B₂O₃–R₂O | 500°C | 800°C | 24 | Lowest CTE |
| LFZA8 | ZnO–B₂O₃–RO–R₂O | 415°C | 500°C | 115 | High CTE |
| RB15 | ZnO–B₂O₃–RO–R₂O | 490°C | 570°C | 110 | High CTE |
| LFZM2 | ZnO–B₂O₃–RO–R₂O | 510°C | 595°C | 105 | High CTE |
| LFZ80 | ZnO–B₂O₃–R₂O | 490°C | 580°C | 80 | Mid CTE |
| LFZ96 | ZnO–B₂O₃–R₂O | 500°C | 580°C | 70 | Mid-low CTE |
| LFZ87 | ZnO–B₂O₃–R₂O | 520°C | 595°C | 60 | Lower CTE |
Typical representative values from the supplied comparison table. Confirm composition restrictions, particle size, substrate compatibility and current guaranteed limits.
Paste Models
Matched LTCC conductor, via, dielectric and resistor pastes.
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| Paste model | Matched system / function | Solids | Viscosity | Sheet resistance | Standard firing |
|---|---|---|---|---|---|
| N-5002 | GCS71 inner / outer print | 74.4% | 375 ±100 Pa·s | 2.2 mΩ/□ / 10 µm | 900°C · 10 min |
| N-5071 | GCS71 via filling | 87% | 330 ±30 Pa·s | 2.6 mΩ/□ / 10 µm | 900°C · 10 min |
| N-5064 | GCS450 print + via | 86.5% | 350 ±100 Pa·s | 1.7 mΩ/□ / 10 µm | 900°C · 10 min |
| N-5146E1 | BR03 inner / outer print | 68% | 350 ±100 Pa·s | Confirm TDS | 900°C · 10 min |
| N-5064E1 | BR03 via filling | Not stated | 350 ±100 Pa·s | Confirm TDS | 900°C · 10 min |
| N-5401 | Post-fired Ag | 84% | 280 ±30 Pa·s | ≤3 mΩ/□ / 10 µm | 850°C · 7 min |
| N-9401 | Dielectric outer layer | 72% | 200 ±30 Pa·s | — | 850–900°C |
| N-7011 | Resistor paste | Not stated | 160 Pa·s | 10 Ω/□ @ 10 µm | 850°C |
| N-7012 | Resistor paste | Not stated | 160 Pa·s | 100 Ω/□ @ 10 µm | 850°C |
Confirm printing thickness, atmosphere, peak time, conductor compatibility, shelf life and storage conditions in the current TDS.
Material Families
Choose the delivery format around the process.
Bonding & Printing Pastes
Glass pastes for bonding, screen printing, glazing and overcoat processes.
Functional Glass Powders
LTCC and sintering additives, crystallized glass and tailored particle-size projects.
Key Matching Inputs
Thermal and process compatibility drive material selection.
Composition, particle size, viscosity, firing profile and performance data are supplied for applicable products after project and confidentiality review.
- Materials to be joined or coated
- Target sealing or firing temperature
- Thermal expansion requirement
- Atmosphere and process method
- Electrical, chemical and hermetic requirements
- Powder, paste or preform delivery format
Technical Data by Request
Exact composition and process ranges are product-specific.
Detailed technical data is shared after a suitable product family and document scope are identified.