News & Insights
Follow HTK activities and review practical articles for glass packaging, ceramic electronic materials, optical packages, sealing materials and thermal-management applications.
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At booth G03, HTK presented LTCC and HTCC material options, powders, matching pastes and representative fired substrates while discussing application requirements with visitors.
Read the exhibition reportPublishing Scope
Future updates will be organized here with a clear publication date, responsible company and links to the relevant product or inquiry page. Technical articles will answer a specific selection or application question instead of repeating promotional claims.
