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Glass Materials

Functional Glass Powder

Confirmed powder grades for preliminary thermal and process matching

Available Grades

Confirmed glass-powder data

Representative values transcribed from the supplied functional-glass comparison table

Swipe horizontally to view all specifications

Grade Glass chemistry Tg Softening point CTE ×10⁻⁷/°C Selection cue
htk66 Bi₂O₃–B₂O₃–ZnO–SiO₂ 380°C 445°C 98 Low-temperature / high CTE
htk23 Bi₂O₃–B₂O₃–ZnO–SiO₂ 435°C 495°C 88 General sintering aid
htk40 Bi₂O₃–B₂O₃–ZnO–SiO₂ 455°C 530°C 78 General sintering aid
htk79 PbO–B₂O₃ 235°C 300°C 145 Lowest softening / contains Pb
htk55 SiO₂–B₂O₃–R₂O 465°C 590°C 77 Lower CTE
htk50 SiO₂–B₂O₃–R₂O 495°C 595°C 73 Lower CTE
htk3 SiO₂–B₂O₃–R₂O 500°C 800°C 24 Lowest CTE
htk8 ZnO–B₂O₃–RO–R₂O 415°C 500°C 115 High CTE
htk15 ZnO–B₂O₃–RO–R₂O 490°C 570°C 110 High CTE
htk2 ZnO–B₂O₃–RO–R₂O 510°C 595°C 105 High CTE
htk80 ZnO–B₂O₃–R₂O 490°C 580°C 80 Mid CTE
htk96 ZnO–B₂O₃–R₂O 500°C 580°C 70 Mid-low CTE
htk87 ZnO–B₂O₃–R₂O 520°C 595°C 60 Lower CTE

Particle-size distribution, atmosphere, application compatibility and guaranteed limits require the current TDS

Selection Inputs

Match the powder to the complete process

Provide substrate, target temperature, CTE, atmosphere, particle-size requirement and required electrical or chemical performance

  • Materials to be joined or processed
  • Target temperature and atmosphere
  • CTE and dielectric requirements

Technical Data

Request grade data and a sample review

Include the application, substrate, process temperature, CTE target and required delivery form

Request Technical Data / Sample