Sealing Glass
Sealing and solder glass powders, bonding pastes, crystallized glass and custom compositions.
Electronic Materials / Hermetic Sealing
HTK supports glass-to-metal, glass-to-ceramic and related hermetic sealing requirements through selected material and component partners. Projects are matched by material system, thermal expansion, process temperature, geometry and reliability target.
Sealing Product Examples
Product Categories
Sealing and solder glass powders, bonding pastes, crystallized glass and custom compositions.
Optical window and lens caps, glass LIDs, hermetic package windows and processed glass parts.
Glass-to-metal sealed components and application-specific assembled parts.
Sealing Material Families
Lead-free and lead-containing options for optical windows, fibers, glass, ceramic and metal joining.
Matched or compression seals for connectors, sensors, laser and electronic packages.
Application-specific sealing systems for batteries, capacitors, thermal and lightweight packages.
Crystallizing glass systems for higher strength, heat resistance, pressure and chemical environments.
Screen-printable or dispensable pastes for bonding metals, ceramics, glass, quartz and chips.
Vacuum-glass, LTCC, MLCC, flame-retardant and high-temperature insulation material families.
Preliminary Product Matching
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| Product family | Typical materials / application | Representative data | Key characteristics |
|---|---|---|---|
| Optical-window solder glass | Lens-to-metal cap; TO60, TO56, TO52, TO46, TO38, TO33, TO25, TO8, TO5 | Sealing: 430–500°C | Lead-free and lead-containing options; high reliability |
| Fiber sealing glass | Single-core, dual-core and fiber-containing configurations | Typical sealing: 330–380°C | Low-temperature joining without damaging the fiber core |
| General glass paste | Metal, ceramic and chip bonding; screen print or dispense | Powder: 3–5 µm; sintering: 320–480°C | Controlled viscosity and low-temperature bonding |
| Glass LID / optical window | Round TO caps and rectangular LIDs | Transmittance: ≥98% @ 1500–1600 nm | Hermetic optical interface; plating and dimensions by project |
| High-temperature insulation coating | Electrical insulation on metal surfaces | ≥100 MΩ at 500°C | Strong adhesion and thermal-shock resistance |
HTK can coordinate product-specific composition, CTE, particle size, hermeticity and process information.
Technical Support
Start with the application or any known conditions. Our team helps organize the remaining technical points and coordinates them with the factory.
Factory Technical Coordination
HTK translates application needs into production and quality points, follows factory progress, and supports technical communication through evaluation and production.