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Electronic Materials / Hermetic Sealing

Materials and Components for Reliable Hermetic Interfaces

HTK supports glass-to-metal, glass-to-ceramic and related hermetic sealing requirements through selected material and component partners. Projects are matched by material system, thermal expansion, process temperature, geometry and reliability target.

Product Categories

Material systems and processed components.

Materials

Sealing Glass

Sealing and solder glass powders, bonding pastes, crystallized glass and custom compositions.

Components

Optical Package Parts

Optical window and lens caps, glass LIDs, hermetic package windows and processed glass parts.

Assemblies

Glass-to-Metal Components

Glass-to-metal sealed components and application-specific assembled parts.

Sealing Material Families

Select the glass system around the joined materials and service environment.

Low Temperature

Solder Glass

Lead-free and lead-containing options for optical windows, fibers, glass, ceramic and metal joining.

Metal Systems

Kovar, Fe-Ni & Stainless

Matched or compression seals for connectors, sensors, laser and electronic packages.

Special Metals

Titanium, Tantalum & Aluminum

Application-specific sealing systems for batteries, capacitors, thermal and lightweight packages.

High Temperature

Glass-Ceramic Seals

Crystallizing glass systems for higher strength, heat resistance, pressure and chemical environments.

Application Form

Glass Pastes

Screen-printable or dispensable pastes for bonding metals, ceramics, glass, quartz and chips.

Functional

Powders & Insulation

Vacuum-glass, LTCC, MLCC, flame-retardant and high-temperature insulation material families.

Preliminary Product Matching

Select the sealing family by substrate, temperature and end use.

The values below are for preliminary selection.

Swipe horizontally to view all specifications.

Product family Typical materials / application Representative data Key characteristics
Optical-window solder glass Lens-to-metal cap; TO60, TO56, TO52, TO46, TO38, TO33, TO25, TO8, TO5 Sealing: 430–500°C Lead-free and lead-containing options; high reliability
Fiber sealing glass Single-core, dual-core and fiber-containing configurations Typical sealing: 330–380°C Low-temperature joining without damaging the fiber core
General glass paste Metal, ceramic and chip bonding; screen print or dispense Powder: 3–5 µm; sintering: 320–480°C Controlled viscosity and low-temperature bonding
Glass LID / optical window Round TO caps and rectangular LIDs Transmittance: ≥98% @ 1500–1600 nm Hermetic optical interface; plating and dimensions by project
High-temperature insulation coating Electrical insulation on metal surfaces ≥100 MΩ at 500°C Strong adhesion and thermal-shock resistance

HTK can coordinate product-specific composition, CTE, particle size, hermeticity and process information.

Technical Support

HTK helps match geometry, temperature and reliability together.

Start with the application or any known conditions. Our team helps organize the remaining technical points and coordinates them with the factory.

  • Material-system matching
  • Process-temperature and CTE coordination
  • Geometry and sealing-process review
  • Hermeticity and reliability planning
  • Sample and technical-document coordination
  • Production and quality-point follow-up

Factory Technical Coordination

A practical bridge between technical requirements and factory execution.

HTK translates application needs into production and quality points, follows factory progress, and supports technical communication through evaluation and production.

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