Resistors & Capacitors
Precision resistive networks and single-layer capacitive structures.
Electronic Materials / Thin-Film Circuits
Precision Foundry Support from Layout Review to Finished Parts
HTK supports thin-film microcircuit foundry projects from substrate and layout review through deposition, photolithography, plating, precision profiling, inspection and selected assembly processes. The supplied capability includes high-precision passive circuits on ceramic, glass and specialty substrates.
Supplied Thin-Film Foundry Material
Review the original capability pages and design-rule tables.
The four pages below are rendered directly from the supplied Thin Film Microcircuits Foundry Service PDF. Click any page to enlarge it. Final limits are confirmed during drawing review.
Typical Project Types
Precision passive and mounting structures.
Filters & Couplers
Filters, couplers, power dividers and microstrip passive circuits.
Mounting Substrates
Optical or semiconductor mounting substrates and custom metallization stacks.
Foundry Design Rules
Representative substrate, pattern and resistor capability.
Values are transcribed from the supplied foundry-service PDF for early design screening. Use the controlled capability confirmation issued for the actual project.
Swipe horizontally to view all specifications.
| Area | Representative capability | Typical / minimum | Notes |
|---|---|---|---|
| Substrate materials | 99.6% alumina, AlN, fused quartz and BeO | Ferrite, glass, sapphire, diamond and SiC also listed | Material availability by project |
| Substrate thickness | 0.127–1.016 mm standard set | As-fired ±10%; polished ±10 µm | Other thicknesses require review |
| Circuit size | Maximum 100 × 100 mm | Pattern-to-edge minimum 20 µm | Layout-dependent |
| Line / space | Typical 25 µm | Minimum 10 µm | Minimum tolerance ±3 µm; typical ±10 µm |
| Layer alignment | Typical ±10 µm | — | Confirm layer count and fiducials |
| Metallized vias | Minimum aspect ratio 0.67:1 | Minimum hole diameter 67% of substrate thickness | Typical diameter equals substrate thickness |
| Resistors | 10–200 Ω/□ nominal; 50 or 100 Ω/□ preferred | Minimum L/W 0.05 mm; resistor spacing 0.05 mm | Non-trimmed tolerance ±10% or ±5% |
BeO and other specialty substrate projects require separate handling, compliance and safety review. Exact manufacturing limits are approved only after file and stack review.
Profiling & Metallization
Representative downstream processing capability.
Swipe horizontally to view all specifications.
| Process | Representative limit / option | Typical materials | Project note |
|---|---|---|---|
| Laser profiling | Maximum substrate thickness 1.0 mm; feature tolerance ±30 µm | Ceramic and selected specialty substrates | Minimum laser-feature-to-pattern gap 30 µm |
| Dicing saw | Maximum substrate 150 × 150 mm; thickness up to 2 mm | Rectangular tile up to 127 × 127 mm; circular up to Φ150 mm | Typical tolerance ±0.050 mm; minimum ±0.025 mm |
| Adhesion / barrier | Ti, TiW, NiCr, Cr / TiW, Pt, Ni | Stack selected by assembly process | Reflow and bonding limits vary by stack |
| Conductor / resistor | Cu or Au / NiCr or TaN | Electrolytic Cu, Ni, Au typically 1–6 µm | Pre-deposited AuSn typically 3–5 µm |
| Data format | DWG, DXF or Gerber | AutoCAD preferred; closed polylines | Submit 1:1 geometry and stack notes |
Representative foundry values from the supplied PDF. Current equipment window, metal thickness tolerance and assembly compatibility are confirmed with the drawing package.
Manufacturing Scope
Review the full stack and inspection requirement.
Submit DXF, DWG or an equivalent manufacturing drawing together with substrate, stack-up, line/space, tolerance, electrical and inspection requirements.
- Sputtering and evaporation
- Photolithography and patterning
- Plating and metallization
- Laser processing, dicing and edge features
- Dimensional and electrical inspection
- Assembly-process compatibility review
Quality & Release
Design limits and quality criteria are confirmed before production.
The supplied PDF references ISO-9000 quality-management specifications and MIL-STD-883C-type quality specifications. Applicability, certification scope, inspection plan and acceptance criteria must be confirmed for the actual supplying entity and project.