Electronic Materials
Conductive & Functional Pastes
Available functions for printing, via filling, dielectric layers, resistance and glass bonding
Conductive & Functional Pastes
Available functions
Swipe horizontally to view all specifications
| Function |
|---|
| inner / outer print |
| via filling |
| print + via |
| inner / outer print |
| via filling |
| Post-fired Ag |
| Dielectric outer layer |
| Resistor paste |
| Resistor paste |
Application Review
Review the paste function and process conditions together
Confirm the required function, print geometry, drying, firing atmosphere, peak temperature and finished resistance
- Required paste function
- Printing and drying conditions
- Firing atmosphere and profile
Technical Data
Request paste data and application review
Include the function, substrate, print thickness, firing profile, target resistance and sample quantity