Bare & Fired Substrates
Alumina, aluminum nitride and related ceramic material options.
Electronic Materials / Ceramic Substrates
Substrate Options for Thermal, Electrical and Packaging Requirements
HTK coordinates 99.6% alumina, aluminum nitride and related ceramic substrate projects for electronic applications. Options include standard and custom sizes, thicknesses from 0.1 to 3 mm, lapping and polishing, with material, surface finish, geometry, tolerance and metallization reviewed together.
Ceramic Substrate Options
99.6% alumina and aluminum nitride substrate options.
Physical Properties
Representative 99.6% alumina and aluminum nitride substrate data.
The values below are for preliminary selection.
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| Property | Condition / unit | 99.6% alumina | Aluminum nitride |
|---|---|---|---|
| Color | — | White | Light gray |
| Volume density | g/cm³ | ≥3.88 | ≥3.30 |
| Water absorption | % | 0 | 0 |
| Gas permeability | — | None | None |
| Flexural strength | Three-point / MPa | ≥500 | ≥370 |
| Thermal conductivity | 25°C / W/m·K | ≥30 | ≥170; ≥200 option shown |
| CTE | 25–300°C / ppm/°C | 7.2 | 4.5 |
| Relative permittivity | @1 MHz | 9.9 | 8.8 |
| Dielectric loss | @1 MHz | ≤1 × 10⁻⁴ | ≤1 × 10⁻⁴ |
| Volume resistivity | 25°C / Ω·cm | >1 × 10¹⁴ | >1 × 10¹⁴ |
| Dielectric strength | kV/mm | ≥15 | ≥15 |
The AlN options shown include ≥170 W/m·K and an additional ≥200 W/m·K option.
Dimensional Capability
Standard formats and thickness ranges.
- Maximum round size
- Φ152.4 mm; ±0.3 mm
- Standard formats
- 50.8, 76.2, 101.6 mm square; Φ100 mm
- Thickness range
- 0.1–3 mm; ±7%
- Lapped / polished tolerance
- ±0.01 mm
Surface Finish and Warp
Surface-roughness options by processing route.
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| Processing | Surface roughness Ra | Warp |
|---|---|---|
| Unpolished | 50–80 nm; 100–200 nm; 200–300 nm options | ≤0.3% |
| Lapped | 100–300 nm | ≤0.1% |
| Polished | ≤25 nm for 99.6% alumina; ≤50 nm for AlN | ≤0.1% |
Standard thickness options: 0.127, 0.254, 0.381, 0.508, 0.635, 0.762 and 1.0 mm.
Available Project Types
From bare substrates to processed structures.
Custom Geometry
Custom shapes, holes, dimensional processing, surface finishing and polishing.
Metallized & Multilayer
Metallized or multilayer ceramic project review from prototype to mass production.
Selection & Technical Support
HTK coordinates material, geometry, surface finish and downstream processing.
Known conditions can be shared at any stage. Our team helps organize the product-specific details and coordinate them with the factory.
- Material and purity comparison
- Size, thickness and tolerance coordination
- Surface roughness and flatness review
- Thermal and electrical property matching
- Metallization and assembly-process coordination
- Production and quality-point follow-up
Technical Review
A drawing or simple application outline is a useful starting point.
HTK will help identify material and processing options, then coordinate product-specific capability and quality points.