Glass Powders, Pastes & Sealing
Glass Powders, Pastes and Hermetic Sealing Materials
Low-temperature joining and hermetic-sealing materials for glass, ceramics, metals, chips and optical components. The range includes solder glass, crystallized sealing glass, functional glass powder, glass paste and application-specific sealed components.
Glass Powders, Pastes & Sealing
Material families
Glass Powders, Pastes & Sealing
Solder and sealing glass
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| Material / product | Function and compatible materials | Representative source data |
|---|---|---|
| Optical-window solder glass | Joins micro-ball, flat, chamfered and aspheric lenses to metal tube caps | Sealing temperature 430–500°C; TO60, TO56, TO52, TO46, TO38, TO33, TO25, TO8 and TO5 |
| Optical-fiber solder glass | Low-temperature connection of optical fiber to other materials without damaging the core structure | Typical sealing temperature 330–380°C; single-core, dual-core and fiber-in configurations |
| Aluminium-alloy solder glass | Hermetic joining of aluminium-alloy housings and 4J50 copper-core leads | Designed for lower-temperature joining; suitable for multiple aluminium-alloy families |
| Insulated-cup solder glass | Vacuum sealing of stainless steel, titanium, ceramic or glass insulated cups | Low sealing temperature and high joining strength; leaded and lead-free families |
| Iron-nickel alloy sealing glass | Hermetic joining of stainless shells and iron-nickel pins | High hermeticity, insulation, heat resistance, impact resistance and pressure resistance |
| Electric-heater sealing glass | Sealing for household heaters, industrial equipment and fluid-heating systems | High electrical insulation and reliability |
| Kovar sealing glass | Seals Kovar and related alloys for RF connectors, sensors and lasers | High joining strength, hermeticity, insulation resistance and chemical stability |
| Titanium sealing glass | Hermetic joining of titanium-alloy housings and feedthroughs | High hermeticity, insulation, heat resistance and thermal-shock resistance |
| Crystallized sealing glass | Sealing under high temperature, high pressure and chemically corrosive conditions | Fine crystal structure for strength and heat resistance; residual glass phase wets metal |
| Kovar-alloy crystallized sealing glass | Crystallized sealing system for Kovar and related alloys | Adjustable CTE range, high strength, chemical stability, hermeticity and heat resistance |
| Iron-nickel-alloy crystallized sealing glass | Crystallized sealing system for iron-nickel alloys | Adjustable CTE range, high strength, chemical stability, hermeticity and heat resistance |
| Tantalum-alloy sealing glass | Hermetic sealing of full- or half-tantalum capacitors | High hermeticity, insulation, chemical stability, high-temperature resistance and strength |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Glass pastes and functional powders
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| Material / product | Function and compatible materials | Representative source data |
|---|---|---|
| Microchip glass paste | Low-temperature joining of stainless steel 304/316L and sensor chips | Pb-Zn-B glass powder with organic vehicle |
| Ultra-low-temperature glass paste | Bonding of ceramics, glass and metals by screen printing or dispensing | Application-specific low-temperature process |
| Quartz-glass / crystal paste | CTE-matched bonding for 33 glass, quartz glass and crystal | Optimized to reduce thermal stress and cracking |
| General glass paste | Bonding of metals, ceramics and chips | 3–5 µm glass powder; screen printing or dispensing; sintering at 320–480°C |
| Vacuum-glass powder | Sealing and connection between vacuum-glass panels | Functional sealing powder |
| LTCC glass powder | Lowers ceramic sintering temperature while supporting dielectric and insulation performance | Low-melting glass additive for LTCC systems |
| Flame-retardant glass powder | Inorganic additive for plastics, rubber and coatings | Heat-resistant and chemically stable silicate-glass powder |
| MLCC glass powder | Lowers microwave-ceramic sintering temperature without materially worsening dielectric loss | Supports metal-electrode firing requirements in multilayer ceramic capacitors |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Solder-glass model data
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| Product family | Grade | CTE (×10⁻⁷ K⁻¹) | Softening point (°C) | Sealing temperature (°C) | Glass system |
|---|---|---|---|---|---|
| Optical-window cap solder glass | SO-514 | 56 | 292 | 440–470 | PbO–B₂O₃–SiO₂ |
| Optical-window cap solder glass | SO-714 | 72 | 297 | 450–480 | PbO–B₂O₃–SiO₂ |
| Optical-window cap solder glass | SO-814 | 83 | 293 | 430–460 | PbO–B₂O₃–SiO₂ |
| Optical-window cap solder glass | SO-844 | 85 | 329 | 450–500 | V₂O₅–P₂O₅–TeO₂ |
| Optical-fiber solder glass | SO-613 | 68 | 230 | 330–380 | PbO–B₂O₃–SiO₂ |
| Optical-fiber solder glass | SO-514 | 56 | 292 | 440–470 | PbO–B₂O₃–SiO₂ |
| Optical-fiber solder glass | SO-409 | 48 | 705 | 930–980 | SiO₂–B₂O₃–R₂O |
| Aluminium-alloy solder glass | SO-9141 | 125 | 284 | 410–450 | PbO–B₂O₃–SiO₂ |
| Aluminium-alloy solder glass | SO-9142 | 135 | 240 | 380–410 | PbO–B₂O₃–SiO₂ |
| Aluminium-alloy solder glass | SO-9351 | 163 | 428 | 550–580 | P₂O₅–B₂O₃–R₂O |
| Electric-heater sealing glass | SO-826 | 89 | 440 | 650–700 | Bi₂O₃–B₂O₃–SiO₂ |
| Electric-heater sealing glass | SO-916 | 93 | 405 | 600–650 | PbO–B₂O₃–SiO₂ |
| Electric-heater sealing glass | SO-927 | 94 | 428 | 600–700 | Bi₂O₃–B₂O₃–ZnO |
| Electric-heater sealing glass | SO-908 | 96 | 530 | 780–870 | SiO₂–Al₂O₃–B₂O₃ |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Insulated-cup solder-glass model data
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| Product family | Grade | Shape | Weight (g) | Sealing temperature (°C) | Glass system |
|---|---|---|---|---|---|
| Insulated-cup solder glass | SO-815 | Hemispherical | 0.2–0.4 | 530–550 | PbO–B₂O₃–SiO₂ |
| Insulated-cup solder glass | SO-935 | Hemispherical | 0.12–0.38 | 510–550 | P₂O₅–SnO–ZnO |
| Insulated-cup solder glass | SO-9152 | Hemispherical | 0.415–0.485 | 510–540 | PbO–B₂O₃–SiO₂ |
| Insulated-cup solder glass | SO-9151 | Hemispherical | 0.2–0.37 | 530–550 | PbO–B₂O₃–SiO₂ |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Hermetic and crystallized sealing-glass model data
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| Product family | Grade | CTE (×10⁻⁷ K⁻¹) | Glass transition point (°C) | Softening point (°C) | Density (g/cm³) | Dielectric constant (25°C, 1 MHz) | Dielectric loss (%) | Sealing temperature (°C) | Glass system |
|---|---|---|---|---|---|---|---|---|---|
| Iron-nickel sealing glass | SE-809 | 91 | 470 | 566 | — | 6.6 | 0.16 | 900–950 | SiO₂–B₂O₃–R₂O |
| Iron-nickel sealing glass | SE-909 | 94 | 474 | 590 | — | 6.9 | 0.25 | 950–980 | SiO₂–B₂O₃–R₂O |
| Kovar sealing glass | SE-309 | 32 | 466 | 570 | — | 4.1 | 0.05 | 980–1050 | SiO₂–B₂O₃ |
| Kovar sealing glass | SE-509 | 56 | 504 | 570 | — | 5.4 | 0.4 | 950–980 | SiO₂–B₂O₃–R₂O |
| Kovar sealing glass | SE-5091 | 51 | 512 | 721 | — | 5.9 | 0.09 | 950–980 | SiO₂–B₂O₃–R₂O |
| Titanium sealing glass | SE-609 | 66 | 556 | 590 | 2.75 | — | — | 900–950 | SiO₂–B₂O₃–R₂O |
| Tantalum-alloy sealing glass | SE-5092 | 52 | 485 | 725 | — | — | — | 1000–1050 | SiO₂–B₂O₃–R₂O |
| Kovar-alloy crystallized glass | SD-407 | 41 | — | 558 | — | — | — | 700–750 | SiO₂–B₂O₃–ZnO |
| Iron-nickel-alloy crystallized glass | SD-915 | 90 | — | 350 | — | — | — | 500–550 | PbO–B₂O₃–ZnO |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Glass-paste model data
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| Product family | Grade | CTE (×10⁻⁷ K⁻¹) | Softening point (°C) | Debinding temperature (°C) | Debinding time (min) | Sintering temperature (°C) | Glass system |
|---|---|---|---|---|---|---|---|
| Ultra-low-temperature glass paste | SP-613 | 80 | 242 | 250 | 30 | 320–370 | PbO–B₂O₃–SiO₂ |
| Ultra-low-temperature glass paste | SP-813 | 65–75 | 230 | 250 | 30 | 330–380 | PbO–B₂O₃–SiO₂ |
| Ultra-low-temperature glass paste | SP-844 | 85 | 329 | 250 | 60 | 430–460 | V₂O₅–P₂O₅–TeO₂ |
| Ultra-low-temperature glass paste | SP-8441 | 88 | 320 | 260 | 50 | 440–480 | V₂O₅–P₂O₅–TeO₂ |
| Microchip glass paste | SP-815 | 88 | 383 | 300–350 | 40–60 | 500–550 | PbO–B₂O₃–ZnO |
| 33 / quartz-glass / crystal paste | SP-413 | 41 | 230 | 250–260 | 60–90 | 380–400 | PbO–B₂O₃–SiO₂ |
| 33 / quartz-glass / crystal paste | SP-414 | 40 | 242 | 280 | 40–60 | 430–450 | PbO–B₂O₃–SiO₂ |
| 33 / quartz-glass / crystal paste | SP-914 | 128 | 320 | 350 | 60 | 420–460 | PbO–B₂O₃–SiO₂ |
| 33 / quartz-glass / crystal paste | SP-9141 | 120 | 329 | 350 | 60 | 450–480 | PbO–B₂O₃–SiO₂ |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Functional glass-powder model data
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| Product family | Grade | CTE (×10⁻⁷ K⁻¹) | Glass transition point (°C) | Softening point (°C) | Dielectric constant (25°C, 1 MHz) | Dielectric loss (%) | Sintering temperature (°C) | Glass system |
|---|---|---|---|---|---|---|---|---|
| LTCC glass powder | SF-508 | 53 | 669 | 834 | 7.4 | 0.0035 | 800–850 | SiO₂–B₂O₃–R₂O |
| LTCC glass powder | SF-608 | 64 | 660 | 760 | 6.7 | 0.0018 | 800–850 | SiO₂–B₂O₃–RO |
| LTCC glass powder | SF-708 | 76 | 655 | 697 | 4.58 | 0.04 | 750–800 | SiO₂–B₂O₃–CaO |
| Vacuum-glass powder | SF-914 | 76 | — | 697 | — | — | 750–800 | PbO–SiO₂–B₂O₃ |
| Vacuum-glass powder | SF-9141 | 53 | — | 834 | — | — | 800–850 | PbO–SiO₂–B₂O₃ |
| MLCC glass powder | SF-915 | 92 | 429 | 457 | — | — | 500–550 | PbO–SiO₂–B₂O₃ |
| Flame-retardant glass powder | SF-705 | 76 | — | 450 | — | — | 500–550 | SiO₂–B₂O₃–ZnO |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
Glass Powders, Pastes & Sealing
Sealed components and measurable performance
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| Component | Representative performance |
|---|---|
| Glass LIT optical package | Round TO-cap: electroless nickel 5.0–7.0 µm; helium leak rate ≤10⁻⁸ Pa·m³/s; transmission ≥98% at 1500–1600 nm. Rectangular LIT: chemical nickel plating, meets an 8-hour salt-spray requirement; the source prints its helium-leak notation as ≤10⁹ Pa·m³/s. |
| High-temperature electrical-insulation coating | Insulation resistance reaches an effectively infinite reading at room temperature under 100 V and ≥100 MΩ at 500°C; strong adhesion and thermal-shock resistance on metal surfaces. |
| Glass micro-fusion chip assembly | Chip-to-base insulation resistance ≥500 MΩ; no gaps between glass/base or glass/chip; joining strength >2 kgf. |
| Optical glass-to-metal package | Column-lens optical glass sealed to a metal housing for optical-communication devices; designed for reliability and hermeticity. |
| Sapphire-to-metal package | Visible-to-infrared sapphire window with high strength, corrosion resistance and optical transmission. |
| Ceramic sealing device | Ceramic-to-ceramic sealing with high joining strength, hermeticity and chemical stability. |
| Kovar gold-plated housing | Custom hermetic package for optical communication, industrial lasers, sensors, microwave devices and IC modules; compatible with subsequent parallel seam sealing. |
| Titanium sealed device | Low density, low thermal conductivity, sufficient strength, corrosion resistance and thermal-shock performance. |
| Fiber-optic panel sealed device | Hermetic connection of fiber-optic panels and metal housings for distortion-controlled image transmission. |
| RF-series sealed device | Kovar-based compact and lightweight sealed device for signal transmission between modules; customizable for project requirements. |
| Sensor / connector / adapter package | Kovar-alloy or stainless-steel housing with 4J29 or 4J50 pins; customizable for pressure and wind-sensor applications. |
| Pure-iron sealed device | Glass-sealed component for electromagnetic relays, magnetic-powder clutches and accelerometer parts; designed for hermeticity, insulation and temperature-shock reliability. |
| Aluminium sealed device | Lightweight hermetic aluminium-alloy housing with metal pins for infrared focal-plane detector applications. |
The following values are for preliminary selection. Final specifications, units, test methods and guaranteed limits must be confirmed in the current product specification or approved drawing.
HTK Support
Technical coordination from selection to factory execution.
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