Electronic Materials / Thermal Management Composites
Diamond-Metal Composites for High Heat-Flux Electronics
Diamond-copper and diamond-aluminum composites combine high thermal conductivity with controlled thermal expansion for heat-spreader and heat-sink applications. HTK coordinates grade selection, geometry, metal coating, samples and project-specific technical confirmation.
Representative Supply Forms
Plates and precision-shaped thermal components.
Representative Grade Data
Four diamond-metal composite grades from the supplied product sheet.
Swipe horizontally to view all specifications.
| Grade | Matrix | Density (g/cm³) | Thermal conductivity (W/m·K) | CTE (×10⁻⁶/K) | Flexural strength (MPa) |
|---|---|---|---|---|---|
| CDW-270-30 | Copper | 7.21 | ≥500 | 5.5–7.5 | ≥320 |
| CDW-100-50 | Copper | 6.05 | 700–1,000 | 4.1–6.7 | ≥300 |
| CDW-100-60 | Copper | 5.31 | 800–1,100 | 4.0–6.2 | ≥300 |
| ADW-100-55 | Aluminum | 3.18 | ≥800 | 5.1–9.3 | ≥380 |
Source range: thermal conductivity 500–1,100 W/m·K and coefficient of thermal expansion 3–9 ×10⁻⁶/K. Actual properties depend on grade, geometry and the agreed test method.
Application Fit
Designed for thermal paths where conductivity and expansion both matter.
The diamond-to-metal interface and composite composition are engineered to reduce thermal resistance while retaining mechanical performance. Suitability must be evaluated with the device, attachment method, thermal cycle and operating environment.
- IGBT and other high-power semiconductor modules
- Microwave and RF electronic devices
- Optoelectronic and semiconductor-laser packages
- High heat-flux modules and precision heat spreaders
- Applications requiring CTE matching to chips or package materials
Supply & Processing
Geometry and surface finish can be reviewed around the assembly process.
The supplied product sheet states that thicknesses from 0.5 mm to several centimeters can be produced. Thin gold or nickel coatings may be applied for compatibility with standard chip-attachment and bonding processes.
- Flat plates, small heat spreaders and larger heat-sink forms
- Custom holes, steps, slots, curves and complex outlines
- Optional Au or Ni surface coating
- Grade and CTE selection around the joined materials
- Samples and current technical data on request
Technical Review
Start with the heat load, chip or package material, target CTE and part drawing.
HTK will coordinate the candidate grade, dimensions, coating, quantity, sample plan and current controlled data with the manufacturing source. Export, end-use and project qualification requirements are reviewed where applicable.