A model request without application and process conditions rarely provides enough information for technical screening · The most useful RFQ explains what the material must do, which materials it must work with and how it will be processed
Do not wait for every value to be final · Mark target, mandatory and unknown items separately so the evaluation can begin without turning assumptions into specifications
Information required for every material inquiry
- Intended application and part function
- Current material or system used, if disclosure is permitted
- Substrates, metals, conductors and adjacent materials
- Target dimensions and tolerances
- Process sequence, atmosphere and temperature profile
- Mandatory performance requirements and test methods
- Sample objective, quantity and decision schedule
LTCC green-sheet inputs
- Operating frequency and dielectric targets
- Dielectric loss requirement and test frequency
- Green and fired thickness
- Sheet dimensions and usable area
- XY and Z shrinkage targets and tolerances
- Layer count, vias, cavities and registration limits
- Conductor, via-fill and firing system
Functional glass powder and sealing-glass inputs
- Required function such as sintering, coating, bonding or sealing
- Composition restrictions
- Tg, softening or operating temperature targets
- CTE target and temperature range
- Particle-size and supplied-form requirements
- Substrates and surface condition
- Firing profile, atmosphere, pressure and joint geometry
Electronic paste inputs
- Required function such as print, via filling, dielectric layer or resistance
- Substrate and matched material system
- Printing or dispensing method
- Target wet and fired thickness
- Line, space, via or coverage geometry
- Drying and firing profile and atmosphere
- Target electrical result and measurement method
Structure the sample evaluation around a decision
| Question | Useful input | Expected decision |
|---|---|---|
| What must the sample prove | One defined electrical, thermal, dimensional or process objective | Pass, revise or reject the candidate |
| What will remain fixed | Substrate, profile, geometry and measurement method | Comparable results across candidates |
| What can change | Grade, thickness, particle form or paste setting | Controlled optimization path |
| What follows | Coupon, test pattern or representative assembly | Next qualification stage |